The ever increasing demand for higher power density is increasing the ambiguity of on board thermal conditions and this call for a thorough understanding of datasheet thermal information to evaluate the thermal performance of semiconductor devices.
This application notes explains the different steady state thermal information provided in the datasheet. It also highlights the inaccuracies in using the thermal information, provided in the datasheet, to calculate the junction temperature and suggests a tool to accurately determine the junction temperature.
Heat is generated in semi-conductor devices due to the power losses in the die during conduction and switching. Once generated, the three mechanisms through which this heat is removed from the package are: